Flexible circuit board materials maker Taiflex Scientific announced on October 28 that its board of directors has approved signing a letter of intent with the global ePaper leader, E Ink Holdings (EIH). Taiflex plans to leverage E Ink's deep capabilities in foundational material development and manufacturing technology in the electronic materials field, combined with its own R&D strength and long industry experience in circuit board materials, to jointly target the AI high-speed transmission materials market as strong complements to each other.

Taiflex stated that this cooperation enables a rapid response to customers' expectations and needs for high-performance materials, mass production capability and stable supply. The initial plan is for Taiflex to provide key materials, with process trial production and validation carried out at E Ink's Hsinchu and Guanyin sites.

Taiflex Chairman Chen Yung-Heng said that with the rapid development of AI technology, the importance of high-frequency, high-speed materials continues to rise. Taiflex has long specialized in copper-clad laminates and advanced electronic materials, and is actively investing in the technology and product development of PTFE materials based on its accumulated expertise in circuit board materials. Taiflex is optimistic about the growth potential of the AI high-speed transmission materials market, and will combine E Ink's rich experience in foundational material development, surface treatment and cross-border manufacturing management with Taiflex's R&D strength in advanced circuit board materials, leveraging the complementary advantages of both parties' technology and manufacturing resources to accelerate the development and mass production of PTFE materials, striving to launch high-speed transmission materials that meet customer needs. The two companies will jointly enter the AI advanced materials supply chain and seize the new opportunities brought by AI industry development.

Under the letter of intent framework, the two parties will jointly advance technology development, process validation and contract manufacturing cooperation for AI high-speed transmission materials. The initial plan is for Taiflex to provide key materials, with trial production and validation at E Ink's Hsinchu and Guanyin sites; further manufacturing service arrangements will be evaluated according to the progress of the cooperation.

Taiflex noted that this letter of intent still awaits deliberation by the board of directors of E Ink Holdings; the relevant commercial terms and execution details will continue to be negotiated under board authorization, and the final formally approved and signed contract shall prevail.