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ePaper innovation-EVC® All-In-One smart card module
ePaper innovation-EVC® All-In-One smart card module
2024-05-21
Shanghai YANGTZE SOFTWARE PARK
BENQ MATERIALS CORPORATION
Chongqing BOE Smart Electronics System Co., Ltd.
TÜV Rheinland Greater China
Refond Optoelectronics Co., Ltd.
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